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MAAP-007649-0001A1 Просмотр технического описания (PDF) - M/A-COM Technology Solutions, Inc.

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Компоненты Описание
производитель
MAAP-007649-0001A1
MA-COM
M/A-COM Technology Solutions, Inc. MA-COM
MAAP-007649-0001A1 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
MAAP-007649-000100
Ultra Linear 2W Power Amplifier
800 to 1000 MHz
Rev. V3
Electrical Specifications1 (Tc= +25oC, VCONT= 4.4 V, VCC = 7.5 V, Z0 = 50 , CW)
Parameter
Frequency Range2
Gain
Gain Variation
Test Conditions
860 to 930 MHz Band
960 MHz Band
Over Temp = -40oC to +85oC
Units
MHz
dB
dB
dB
Min
800
Typ
19.5
19
1.3
Max
1000
860 to 930 MHz Band
dB
-10
-15
Input Return Loss
960 MHz Band
dB
-10
-15
Output Return Loss
860 to 960 Band
Output P1dB
860 to 960 Band
PAE
860 to 960 Band @ P1dB
Output IP3
(2 Tone, F = 1MHz)
Spectral Linearity
Pout = +20 dBm / tone, 860 to 960 MHz
Pout = +27 dBm / tone, 860 to 960 MHz
Pout for DRM3 Mask compliance
Harmonics
@ Pout = 28 to 30 dBm
Bias Supply
VCC
Control Voltage
VCONT Power Amp ON
VCONT Power Amp OFF
Bias Current
Current Variation
Quiescent Current Iccq
Control current Icont
- 10oC to +70oC, @ Pout= +31 dBm
Ruggedness
Load VSWR 8:1 max., 0o to 360o Phase,
Pout < 31 dBm , ZL = 50
Thermal Resistance θjc5
Junction Temperature Rise Above Baseplate Tjc5
dB
dBm
%
dBm
dBm
dBm
dBc
V
V
V
mA
mA
%
oC/W
oC
-8
-11
33
34
46
50
47
49
43
44.5
30.7
-48
7.5
8.5
4.1
4.4
4.7
2
540
590
8
10
3
6
No Permanent Damage
16.6oC/W
68oC
1. All data is based on the Evaluation Circuit Board (page 6), which is tuned specifi-
cally for 860 to 960 MHz (RFID Band), and is attached to a solid metal base for
heat sinking.
Absolute Maximum Ratings4
NOTE: Improper heat sinking can degrade performance.
2. The device is capable of operating from 800 to 1000 MHz, with an optimized I/O
match over narrow bands.
3. DRM Mask: EPC Global Class 1 Generation Dense Reader Mode Spectral Mask.
Parameter
Absolute Maximum
4. Caution: Operation beyond Absolute Maximum Ratings can degrade
performance or cause permanent damage.
RF Input Power
+18 dBm
5. Heat dissipates through several layers between the transistor junctions and metal
baseplate. The PQFN packaged assembly (HBT MMIC die / conductive epoxy /
Supply Voltage VCC
8.5 V
metal slug interface) is mounted to the application circuit board using SN63
solder. The metal vias in the circuit board dissipate heat to the baseplate.
Control Voltage VCONT
5V
Operating the MAAP-007649-000100
The MAAM-007649-000100 can be damaged by electrostatic dis-
charge (ESD). Use proper ESD control techniques when handling this
device. To operate the MAAP-007649-000100, follow these steps:
Supply Current with RF Drive
Supply Current without RF Drive
Load VSWR
Duty Cycle with Heat Sink Block
800 mA
600 mA
8:1
100%
1.) Connect the 50 ohm load
2.) Apply VCC (+7.5 Vdc)
3.) Apply VCONT (+4.4 Vdc)
4.) Set the Input Power Level (Pin)
5.) Turn off in reverse order
Duty Cycle without Heat Sink Block
Operating Temperature
Storage Temperature
Device Junction Temperature TJ, max
50%
-40oC to +85o C
-65oC to +150o C
150oC
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
India Tel: +91.80.4155721
China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.

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