MPX4105A Просмотр технического описания (PDF) - NXP Semiconductors.
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MPX4105A Datasheet PDF : 7 Pages
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Pressure
On-chip Temperature Compensation and Calibration
Figure 2. illustrates an absolute sensing chip in the basic
chip carrier (Case 867).
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the sensor diaphragm. The MPX4105A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Figure 3. shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4. shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over a temperature range of
0° to 85°C. The output will saturate outside of the specified
pressure range.
Fluoro Silicone
Gel Die Coat
Die
P1
Wire Bond
Stainless
Steel Cap
Epoxy Plastic Case
Lead Frame
Absolute Element
P2
Die Bond
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram (not to scale)
+5 V
1.0 μF
Vout
Vs
IPS
0.01 μF
GND
Output
470 pF
MPX4105A
4
Figure 3. Recommended Power Supply
Decoupling and Output Filtering
5.0
4.5 Transfer Function:
Vout = Vs* (0.01*P-0.09) ± Error
4.0 VS = 5.1 Vdc
3.5 Temperature = 0 to 85°C
3.0 15 kPa to 105 kPa
TYP
2.5 MPX4105A
2.0
MAX
1.5
MIN
1.0
0.5
0
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output versus Absolute Pressure
Sensors
Freescale Semiconductor
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