ADN2847ACP-48 Просмотр технического описания (PDF) - Analog Devices
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ADN2847ACP-48 Datasheet PDF : 12 Pages
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ADN2847
Parameter
Min Typ
Max
Unit
Conditions/Comments
SUPPLY
ICC7
VCC8
50
3.0
3.3
mA
3.6
V
IBIAS = IMOD = 0
NOTES
1Temperature range: –40∞C to +85∞C.
2The high speed performance for the die version of ADN2847 can be achieved when using the bonding diagram shown in Figure 3.
3Measured into a 25 W load using a 11110000 pattern at 2.5 Gbps.
4When the voltage on DATAP is greater than the voltage on DATAN, the modulation current flows in the IMODP pin.
5Guaranteed by design and characterization. Not production tested.
6IDTONE may cause eye distortion.
I7
CCMIN
for
power
calculation
on
page
8
is
the
typical
I CC
given.
8All VCC pins should be shorted together.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS1
(TA = 25∞C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 V
Digital Inputs (ALS, LBWSET, CLKSEL) . . –0.3 V to VCC + 0.3 V
IMODN, IMODP . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 1.2 V
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . –40∞C to +85∞C
Storage Temperature Range . . . . . . . . . . . . . –65∞C to +150∞C
Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . . 150∞C
48-Lead LFCSP Package
Power Dissipation2 . . . . . . . . . . . . . . . . (TJ max – TA)/qJA W
qJA Thermal Impedance3 . . . . . . . . . . . . . . . . . . . . . 25∞C/W
Lead Temperature (Soldering 10 sec) . . . . . . . . . . . . 300∞C
32-Lead LFCSP Package
Power Dissipation2 . . . . . . . . . . . . . . . . (TJ max – TA)/qJA W
qJA Thermal Impedance3 . . . . . . . . . . . . . . . . . . . . . 32∞C/W
Lead Temperature (Soldering 10 sec) . . . . . . . . . . . . 300∞C
NOTES
1 Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2 Power consumption formulae are provided on page 8.
3 qJA is defined when part is soldered on a 4-layer board.
ORDERING GUIDE
Model
Temperature
Range
Package
Description
ADN2847ACP-32
ADN2847ACP-48
ADN2847ACP-32-RL
ADN2847ACP-32-RL7
ADN2847ACP-48-RL
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
–40∞C to +85∞C
32-Lead LFCSP
48-Lead LFCSP
32-Lead LFCSP
32-Lead LFCSP
48-Lead LFCSP
SETUP
tS
HOLD
tH
DATAP/DATAN
CLKP
Figure 1. Setup and Hold Time
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADN2847 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
REV. 0
–3–
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