AD8279 Просмотр технического описания (PDF) - Analog Devices

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AD8279

Low Power, Wide Supply Range, Low Cost Difference Amplifiers, G = ½, 2

Analog Devices 

Preliminary Technical Data

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Supply Voltage

Maximum Voltage at Any Input Pin

Minimum Voltage at Any Input Pin

Storage Temperature Range

Specified Temperature Range

Package Glass Transition Temperature (TG)

Rating

±18 V

−VS + 40 V

+VS − 40 V

−65°C to +150°C

−40°C to +85°C

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

The θJA values in Table 7 assume a 4-layer JEDEC standard

board with zero airflow.

Table 7. Thermal Resistance

Package Type

θJA

14-Lead SOIC

105

Unit

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the AD8279 is limited

by the associated rise in junction temperature (TJ) on the die. At

approximately 150°C, which is the glass transition temperature,

the properties of the plastic change. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the amplifiers. Exceeding a temperature of 150°C for an

extended period may result in a loss of functionality.

AD8279

2.0

TJ MAX = 150°C

1.6

14-LEAD SOIC

θJA = 105°C/W

1.2

8-LEAD SOIC

θJA = 121°C/W

0.8

8-LEAD MSOP

θJA = 135°C/W

0.4

0

–50 –25

0

25

50

75

100 125

AMBIENT TEMERATURE (°C)

Figure 2. Maximum Power Dissipation vs. Ambient Temperature

SHORT-CIRCUIT CURRENT

The AD8279 has built-in, short-circuit protection that limits the

output current (see Figure 26 for more information). While the

short-circuit condition itself does not damage the part, the heat

generated by the condition can cause the part to exceed its

maximum junction temperature, with corresponding negative

effects on reliability. Figure 2 and Figure 26, combined with

knowledge of the supply voltages and ambient temperature of the

part can be used to determine whether a short circuit will cause

the part to exceed its maximum junction temperature.

ESD CAUTION

Rev. PrA | Page 7 of 18

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