4N32 Просмотр технического описания (PDF) - Fairchild Semiconductor
Номер в каталоге
Компоненты Описание
производитель
4N32 Datasheet PDF : 13 Pages
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Black Package (No -M Suffix)
Package Dimensions (Through Hole)
PIN 1
ID.
0.270 (6.86)
0.240 (6.10)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.200 (5.08)
0.115 (2.92)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.300 (7.62)
TYP
Package Dimensions (0.4” Lead Spacing)
PIN 1 ID
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.154 (3.90)
0.100 (2.54)
0.022 (0.56)
0.016 (0.41)
0.004 (0.10)
MIN
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
0° to 15°
0.400 (10.16)
TYP
Note:
All dimensions are in inches (millimeters).
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
0.390 (9.90)
0.260 (6.60) 0.332 (8.43)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.200 (5.08)
0.115 (2.93)
0.025 (0.63)
0.020 (0.51)
0.020 (0.50)
0.016 (0.41)
0.014 (0.36)
0.010 (0.25)
0.320 (8.13)
0.012 (0.30)
0.008 (0.20)
0.100 [2.54]
0.035 (0.88)
0.012 (0.30)
Recommended Pad Layout for
Surface Mount Leadform
0.070 (1.78)
0.060 (1.52)
0.415 (10.54)
0.100 (2.54)
0.295 (7.49)
0.030 (0.76)
©2006 Fairchild Semiconductor Corporation
4N29, 4N30, 4N31, 4N32, 4N33 Rev. 1.0.1
8
www.fairchildsemi.com
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