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TEC1-12708 Просмотр технического описания (PDF) - HB Electronic Components

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производитель
TEC1-12708
HB
HB Electronic Components HB
TEC1-12708 Datasheet PDF : 3 Pages
1 2 3
TEC1-12708
Ceramic Material: Alumina (Al2O3)
Solder Construction: 138ºC, Bismuth Tin (BiSn)
Size table:
A
B
C
40
40
3.5
Operating Tips
Max. Operating Temperature: 138oC
Do not exceed Imax or Vmax when
operating module.
Life expectancy: 200,000 hours
Please consult HB for moisture
protection options (seeling).
Failure rate based on long time testings: 0.2%.
Copyright HB Corporation. HB reserves the right to change these specifications without notice.
3
Rev 2.03

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