ISL59114 Просмотр технического описания (PDF) - Renesas Electronics
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ISL59114 Datasheet PDF : 10 Pages
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ISL59114
Power Dissipation
With the high output drive capability of the ISL59114, it is
possible to exceed the +125°C absolute maximum junction
temperature under certain load current conditions.
Therefore, it is important to calculate the maximum junction
temperature for an application to determine if load conditions
or package types need to be modified to assure operation of
the amplifier in a safe operating area.
The maximum power dissipation allowed in a package is
determined according to:
PDMAX
=
T----J---M-----A----X-----–-----T----A---M-----A----X--
JA
Where:
TJMAX = Maximum junction temperature
TAMAX = Maximum ambient temperature
JA = Thermal resistance of the package
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the load, or:
for sourcing:
PDMAX = VS ISMAX + VS – VOUT -V----OR----UL----T--
for sinking:
PDMAX = VS ISMAX + VOUT – VS ILOAD
Where:
VS = Supply voltage
ISMAX = Maximum quiescent supply current
VOUT = Maximum output voltage of the application
RLOAD = Load resistance tied to ground
ILOAD = Load current
Power Supply Bypassing Printed Circuit Board
Layout
As with any modern operational amplifier, a good printed
circuit board layout is necessary for optimum performance.
Lead lengths should be as short as possible. The power
supply pin must be well bypassed to reduce the risk of
oscillation. For normal single supply operation, a single
4.7µF tantalum capacitor in parallel with a 0.1µF ceramic
capacitor from VS+ to GND will suffice.
Printed Circuit Board Layout
For good AC performance, parasitic capacitance should be
kept to minimum. Use of wire wound resistors should be
avoided because of their additional series inductance. Use
of sockets should also be avoided if possible. Sockets add
parasitic inductance and capacitance that can result in
compromised performance.
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FN6184 Rev 2.00
September 21, 2006
Page 9 of 10
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