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ISL21007 Просмотр технического описания (PDF) - Renesas Electronics

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производитель
ISL21007
Renesas
Renesas Electronics Renesas
ISL21007 Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
ISL21007
Package Outline Drawing
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 4, 1/12
For the most recent package outline drawing, see M8.15.
INDEX
AREA
1
2
3
TOP VIEW
6.20 (0.244)
5.80 (0.228)
4.00 (0.157)
3.80 (0.150)
DETAIL "A"
1.27 (0.050)
0.40 (0.016)
0.50 (0.20)
0.25 (0.01)
x 45°
0.25 (0.010)
0.19 (0.008)
SIDE VIEW “B”
5.00 (0.197)
4.80 (0.189)
1.27 (0.050)
0.51(0.020)
0.33(0.013)
SIDE VIEW “A
FN6326 Rev.12.00
Jun 9, 2017
2.20 (0.087)
SEATING PLANE
1
1.75 (0.069)
2
1.35 (0.053)
3
-C-
4
0.25(0.010)
0.10(0.004)
5.20(0.205)
8
0.60 (0.023)
7
1.27 (0.050)
6
5
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs. Mold
flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per
side.
3. Package width does not include interlead flash or protrusions. Interlead flash
and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
Page 20 of 20

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