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ISL29020IROZ-EVALZ Просмотр технического описания (PDF) - Renesas Electronics

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ISL29020IROZ-EVALZ Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
ISL29020
t
L
DLENS
D2 > 1.5mm
LIGHT PIPE
D2
DLENS
ISL29020
FIGURE 5. WINDOW WITH LIGHT GUIDE/PIPE
Suggested PCB Footprint
It is important that the users check the “Surface Mount
Assembly Guidelines for Optical Dual FlatPack No Lead
(ODFN) Package” before starting ODFN product board
mounting.
Typical Circuit
A typical application for the ISL29020 is shown in Figure 6. The
ISL29020’s I2C address is hardwired as 1000100. The device
can be tied onto a system’s I2C bus together with other I2C
compliant devices.
http://www.intersil.com/data/tb/TB477.pdf
Soldering Considerations
Layout Considerations
The ISL29020 is relatively insensitive to layout. Like other I2C
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Convection heating is recommended for reflow soldering; direct-
infrared heating is not recommended. The plastic ODFN
package does not require a custom reflow soldering profile, and
is qualified to +260°C. A standard reflow soldering profile with a
+260°C maximum is recommended.
Route the supply and I2C traces as far as possible from all
sources of noise. Use one 0.01µF power-supply decoupling
capacitor, placed close to the device.
R1
10k
R2
10k
1.7V TO 3.6V
I2C MASTER
MICROCONTROLLER
2.25V TO 3.3V
SDA
SCL
C1
0.01µF
FN6505 Rev 1.00
August 20, 2009
I2C SLAVE_0
1 VDD
SDA 6
I2C SLAVE_1
SDA
I2C SLAVE_n
SDA
2 GND SCL 5
SCL
SCL
3 REXT
A0 4
REXT
500k ISL29020
FIGURE 6. ISL29020 TYPICAL CIRCUIT
Page 8 of 11

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