APTM100H18FG Просмотр технического описания (PDF) - Microsemi Corporation

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Компоненты Описание

производитель

APTM100H18FG

Full - Bridge MOSFET Power Module

Microsemi Corporation 

APTM100H18FG

Thermal and package characteristics

Symbol Characteristic

RthJC

VISOL

TJ

Junction to Case Thermal Resistance

RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz

Operating junction temperature range

TSTG

TC

Torque

Storage Temperature Range

Operating Case Temperature

Mounting torque

To heatsink

For terminals

Wt Package Weight

Min Typ Max Unit

0.16 °C/W

4000

V

-40

150

-40

125 °C

-40

100

M6 3

M5 2

5

3.5

N.m

300 g

SP6 Package outline (dimensions in mm)

See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com

www.microsemi.com

3–7

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