2606B Просмотр технического описания (PDF) - TEKTRONIX
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2606B Datasheet PDF : 13 Pages
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Datasheet
Unmatched Throughput for Automated Test
with TSP Technology
For test applications that demand the highest levels of
automation and throughput, the 2606B’s TSP technology
delivers industry-best performance. TSP technology goes
far beyond traditional test command sequencers – it fully
embeds then executes complete test programs from
within the SMU instrument itself. This virtually eliminates
time-consuming bus communications to and from the
PC controller and thus dramatically improves overall
test times.
• Conditional branching
• Advanced calculations
and flow control
• Variables
• Pass/fail test
• Prober/handler control
• Datalogging/
formatting
Test Script
DUT
TSP technology executes complete test programs from the 2606B’s non-
volatile memory.
SMU-Per-Pin Parallel Testing with TSP-Link
Technology
TSP-Link is a channel expansion bus that enables multiple
Series 2606B’s to be inter-connected or connected with
other Keithley TSP-enabled instruments and function
as a single, tightly-synchronized, multi-channel system.
The 2606B’s TSP-Link Technology works together with
its TSP technology to enable high-speed, SMU-per-
pin parallel testing. Unlike other high-speed solutions
such as large ATE systems, the 2606B achieves parallel
test performance without the cost or burden of a
mainframe. The TSP-Link based system also enables
superior flexibility, allowing for quick and easy system re-
configuration as test requirements change.
<500 ns
SMU1
SMU2
SMU3
SMU4
All channels in the TSP-Link system are synchronized to under 500 ns.
PD LED 1
LED 2
LED 3
DIO
PC
LAN
TSP-Link
or
PD LED 1
LED 2
LED 3
DIO
PC
LAN
TSP-Link
PD LED 1
LED 2
LED 3
DIO
SMU-per-pin parallel or multi-pin device testing using TSP and TSP-Link
technologies improves test throughput and lowers the cost of test.
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