BTB08 Просмотр технического описания (PDF) - STMicroelectronics
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BTB08 Datasheet PDF : 21 Pages
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BTA08, BTB08, T810, T835, T850
DPAK package information
Note:
Table 6. DPAK package mechanical data
Ref.
Millimeters
Min.
Typ.
Max.
A
2.18
2.40
A1
0.90
1.10
A2
0.03
0.23
b
0.64
0.90
b4
4.95
5.46
c
0.46
0.61
c2
0.46
0.60
D
5.97
6.22
D1
5.10
E
6.35
6.73
E1
4.32
e
2.29
e1
4.57
H
9.35
10.40
L
1.00
1.78
L2
1.27
L4
0.60
1.02
V2
0°
+8°
1. Dimensions in inches are given for reference only
Dimensions
Min.
0.0858
0.0354
0.0012
0.0252
0.1949
0.0181
0.0181
0.2350
0.2008
0.2500
0.1701
0.3681
0.0394
0.0236
0°
Inches(1)
Typ.
0.0900
0.1800
Max.
0.0945
0.0433
0.0091
0.354
0.2150
0.0240
0.0236
0.2449
0.2650
0.4094
0.0701
0.0500
0.0402
+8°
This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
Figure 14. DPAK recommended footprint (dimensions are in mm)
12.7
6.7
3.0
3.0
A
6.7
4.572
B
1.6
The device must be positioned within 0.05 A B
DS2114 - Rev 15
page 9/21
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