BTB08 Просмотр технического описания (PDF) - STMicroelectronics
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BTB08 Datasheet PDF : 21 Pages
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BTA08, BTB08, T810, T835, T850
Characteristics (curves)
Figure 11. Relative variation of critical rate of decrease of Figure 12. DPAK and D2PAK thermal resistance junction
main current versus junction temperature
to ambient versus copper surface under tab
(dl/dt)c [Tj] / [Tj specified]
6
5
4
3
2
1
Tj(°C)
0
0
25
50
75
100
125
Rth(j-a)(°C/W)
100
90
Printed circuit board FR4, copper thickness: 35 µm
80
70
60
DPAK
50
40
30
D²PAK
20
10
0
S(cm²)
0 4 8 12 16 20 24 28 32 36 40
DS2114 - Rev 15
page 6/21
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