HCPL-8100 Просмотр технического описания (PDF) - HP => Agilent Technologies
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HCPL-8100 Datasheet PDF : 11 Pages
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Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/- 0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
200
160°C
150°C
140°C
100
2.5°C ± 0.5°C/SEC.
3°C + 1°C/- 0.5°C
PREHEATING TIME
150°C, 90 + 30 SEC.
30
SEC.
30
SEC.
PEAK
TEMP.
240°C
SOLDERING
TIME
200°C
PEAK
TEMP.
230°C
50 SEC.
ROOM
TEMPERATURE
0
0
TIGHT
TYPICAL
LOOSE
50
100
150
200
250
TIME (SECONDS)
Absolute Maximum Ratings
Parameter
Storage Temperature
Ambient Operating Temperature
Junction Temperature
Supply Voltage
Output Voltage
Tx-in Voltage
Tx-en Voltage
Solder Reflow Temperature Profile
Symbol
Min.
Max.
TS
−55
125
TA
−40
85
TJ
150
VCC
−0.5
5.5
VO
−0.5
VCC
V Tx-in
−0.5
VCC
V Tx-en
−0.5
VCC
(See Solder Reflow Temperature Profile Section)
Unit
°C
°C
°C
Volts
Volts
Volts
Volts
Recommended Operating Conditions
Parameter
Symbol
Min.
Typ.
Ambient Operating Temperature TA
−40
25
Supply Voltage
VCC
4.75
5
Max.
Unit
85
°C
5.25
V
4
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