TAT8857A1H-PCB24V Просмотр технического описания (PDF) - TriQuint Semiconductor

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TAT8857A1H-PCB24V

CATV Doubler – Hybrid RFIC

TriQuint Semiconductor 

Mechanical Information

Package Marking and Dimensions

TAT8857A1H

CATV Doubler – Hybrid RFIC

NOTES:

1. All dimensions are in millimeters. Angles are in degrees.

2. Except where noted, this part outline conforms to JEDEC standard MO-220, Issue E (Variation VGGC) for thermally

enhanced plastic very thin fine pitch quad flat no lead package (QFN).

3. Dimension and tolerance formats conform to ASME Y14.4M-1994.

4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.

PCB Mounting Pattern

4

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

2. Use 1 oz. copper minimum for top and bottom layer metal.

3. A heat sink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation.

Damage to the device can occur without the use of one.

4. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation.

5. Do not remove or minimize via hole structure in the PCB. Thermal and RF grounding is critical.

6. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).

7. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.

Data Sheet: Rev. B 06/30/13

© 2013 TriQuint

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Disclaimer: Subject to change without notice

www.triquint.com

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