HI-524 Просмотр технического описания (PDF) - Renesas Electronics
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HI-524 Datasheet PDF : 6 Pages
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HI-524
Die Characteristics
DIE DIMENSIONS:
2250m x 3720m x 485m
METALLIZATION:
Type: CuAl
Thickness: 16kÅ 2kÅ
Metallization Mask Layout
IN1
SIG
GND
IN2
SIG
GND
FB (OUT)
PASSIVATION:
Type: Nitride Over Silox
Nitride Thickness: 3.5kÅ 1kÅ
Silox Thickness: 12kÅ 2kÅ
WORST CASE CURRENT DENSITY:
1.58 x 105 A/cm2
HI-524
EN AO
A1
SUPPLY
GND
IN3
SIG
GND
IN4
SIG
GND
SIG
GND
-V FB (IN)
+V OUT
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FN3148 Rev 3.00
April 2002
Page 6 of 6
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