RFD3055 Просмотр технического описания (PDF) - Harris Semiconductor

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Компоненты Описание

производитель

RFD3055

12A, 60V, Avalanche Rated, N-Channel Enhancement-Mode Power MOSFETs (MegaFETs)

Harris Semiconductor 

RFD3055, RFD3055SM, RFP3055

Packaging

ØP

Q

E

H1

A

A1

D

TERM. 4

E1

L1

45o

D1

b1

L

b

c

60o

123

e

J1

e1

NOTES:

1. These dimensions are within allowable dimensions of Rev. J of

JEDEC TO-220AB outline dated 3-24-87.

2. Lead dimension and finish uncontrolled in L1.

3. Lead dimension (without solder).

4. Add typically 0.002 inches (0.05mm) for solder coating.

5. Position of lead to be measured 0.250 inches (6.35mm) from bot-

tom of dimension D.

6. Position of lead to be measured 0.100 inches (2.54mm) from bot-

tom of dimension D.

TO-220AB

3 LEAD JEDEC TO-220AB PLASTIC PACKAGE

INCHES

MILLIMETERS

SYMBOL MIN

MAX

MIN

MAX

A

0.170

0.180

4.32

4.57

A1

0.048

0.052

1.22

1.32

b

0.030

0.034

0.77

0.86

b1

0.045

0.055

1.15

1.39

c

0.014

0.019

0.36

0.48

D

0.590

0.610 14.99

15.49

D1

-

0.160

-

4.06

E

0.395

0.410 10.04

10.41

E1

-

0.030

-

0.76

e

0.100 TYP

2.54 TYP

e1

0.200 BSC

5.08 BSC

H1

0.235

0.255

5.97

6.47

J1

0.100

0.110

2.54

2.79

L

0.530

0.550 13.47

13.97

L1

0.130

0.150

3.31

3.81

ØP

0.149

0.153

3.79

3.88

Q

0.102

0.112

2.60

2.84

7. Controlling dimension: Inch.

8. Revision 1 dated 1-93.

NOTES

-

-

3, 4

2, 3

2, 3, 4

-

-

-

-

5

5

-

6

-

2

-

-

E

H1

b2

D

A

A1

TERM. 4

SEATING

PLANE

L1

L

b

b1

c

1 23

e

J1

e1

NOTES:

1. These dimensions are within allowable dimensions of Rev. C of

JEDEC TO-251AA outline dated 9-88.

2. Solder finish uncontrolled.

3. Dimension (without solder).

4. Add typically 0.0006 inches (0.015mm) for solder coating.

5. Position of lead to be measured 0.250 inches (6.35mm) from bot-

TO-251AA

3 LEAD JEDEC TO-251AA PLASTIC PACKAGE

INCHES

MILLIMETERS

SYMBOL MIN

MAX

MIN

MAX

A

0.086

0.094

2.19

2.38

A1

0.018

0.022

0.46

0.55

b

0.028

0.032

0.72

0.81

b1

0.033

0.040

0.84

1.01

b2

0.205

0.215

5.21

5.46

c

0.018

0.022

0.46

0.55

D

0.270

0.290

6.86

7.36

E

0.250

0.265

6.35

6.73

e

0.090 TYP

2.28 TYP

e1

0.180 BSC

4.57 BSC

H1

0.035

0.045

0.89

1.14

J1

0.040

0.045

1.02

1.14

L

0.355

0.375

9.02

9.52

L1

0.075

0.090

1.91

2.28

NOTES

-

3, 4

3, 4

3

3, 4

3, 4

-

-

5

5

-

6

-

2

tom of dimension D.

6. Position of lead to be measured 0.100 inches (2.54mm) from bot-

tom of dimension D.

7. Controlling dimension: Inch.

8. Revision 1 dated 1-93.

7

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