NX25P40-VNI Просмотр технического описания (PDF) - NexFlash -> Winbond Electronics

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Компоненты Описание

производитель

NX25P40-VNI

1M-BIT, 2M-BIT AND 4M-BIT Serial Flash Memory with 40MHz SPI

NexFlash -> Winbond Electronics 

1M / 2M / 4M-BIT SERIAL FLASH MEMORY with 40MHz SPI

NX25P10, NX25P20 AND NX25P40

PACKAGING INFORMATION

8-Pin SOIC 150-mil (Package Code N)

1

D

CP

E1 E

b

SEATING PLANE

A2 A

e

A1

L

α

C

Package Dimensions(1)

Symbol

A

A1

A2

b

C

D(3)

E

E1(3)

e(2)

L

α

CP

Millimeters

Min Typ. Max

1.47 1.60 1.72

0.10

0.24

1.45

0.33 0.41 0.50

0.19 0.20 0.25

4.80 4.85 4.95

5.80 6.00 6.19

3.80 3.90 4.00

1.27 BSC

0.40 0.71 1.27

0o

8o

0.10

Inches

Min Typ. Max

0.058 0.063 0.068

0.004

0.009

0.057

0.013 0.016 0.020

0.0075 0.008 0.0098

0.189 0.191 0.195

0.228 0.236 0.244

0.150 0.154 0.157

0.050 BSC

0.015 0.028 0.050

0o

8o

0.004

Notes:

1. Controlling dimensions: inches,

unless otherwise specified.

2. BSC = Basic lead spacing between

centers.

3. Dimensions D and E1 do not include

mold flash protrusions and should

be measured from the bottom of the

package.

4. Formed leads shall be planar with

respect to one another within .0004

inches at the seating plane.

26

NexFlash Technologies, Inc.

PRELIMINARY MKP-0009 Rev 6 NXSF040I-0405

04/04/05 ©

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