HCS112HMSR Просмотр технического описания (PDF) - Intersil

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производитель

HCS112HMSR

Radiation Hardened Dual JK Flip-Flop

Intersil 

Die Characteristics

DIE DIMENSIONS:

89 x 88 mils

2.25 x 2.24mm

METALLIZATION:

Type: SiAl

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

KA

(2)

HCS112MS

HCS112MS

CP1

(1)

VCC

(16)

JA (3)

SA (4)

QA (5)

QA (6)

(15) RA

(14) RB

(13) CPB

(12) KB

QB (7)

(11) JB

(8)

(9)

(10)

GND

QB

SB

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCS112 is TA14341A.

Spec Number 518830

19

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