USB3300-EZK(2005) Просмотр технического описания (PDF) - SMSC -> Microchip
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USB3300-EZK Datasheet PDF : 11 Pages
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Hi-Speed USB Host or Device PHY with ULPI Low Pin Interface
Package Outline
The USB3300 is offered in a compact 32 lead-free QFN package.
Figure 7 USB3300-EZK 32 Pin QFN Package Outline, 5 x 5 x 0.9 mm Body (Lead-Free)
Table 2 32 Terminal QFN Package Parameters
MIN
NOMINAL
MAX
A
0.80
~
1.00
A1
0
~
0.05
A2
0.60
~
0.80
A3
0.20 REF
D
4.85
~
5.15
D1
4.55
~
4.95
D2
1.25
3.5
3.80
E
4.85
~
5.15
E1
4.55
~
4.95
E2
1.25
3.5
3.80
L
0.30
~
0.50
e
0.50 Basic
b
0.18
~
0.30
ccc
~
~
0.08
REMARKS
Overall Package Height
Standoff
Mold Thickness
Copper Lead-frame Substrate
X Overall Size
X Mold Cap Size
X exposed Pad Size
Y Overall Size
Y Mold Cap Size
Y exposed Pad Size
Terminal Length
Terminal Pitch
Terminal Width
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Dimension b applies to plated terminals and is measured between 0.15mm and 0.30mm from the
terminal tip. Tolerance on the true position of the leads is ± 0.05 mm at maximum material
conditions (MMC).
3. Details of terminal #1 identifier are optional but must be located within the zone indicated.
4. Coplanarity zone applies to exposed pad and terminals.
SMSC USB3300
11
PRODUCT PREVIEW
Revision 1.02 (02-16-05)
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