EA2-3NU Просмотр технического описания (PDF) - KEMET

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EA2-3NU

Miniature Signal Relays

KEMET 

Miniature Signal Relays – EA2/EB2 Series

Land Pattern – Millimeters

EA2 (bottom view)

10 – ø 0.8

EB2 (bottom view)

1.0

2.94

2.54

10.16

General tolerance: ±0.1

2.54

10.16

General tolerance: ±0.1

Soldering Process

EA2 – Through-hole Mounting

Automatic Soldering

Preheating: 110–120°C / 110 seconds (maximum)

Solder temperature: 260°C maximum

Solder time: 5 seconds maximum

Note: KEMET recommends cooling down a printed circuit board to less than 110°C within 40 seconds after soldering.

Manual Soldering

Solder temperature: 350°C maximum

Solder time: 3 seconds maximum

EB2 – Surface Mounting

IRS Method

Temperature

(˚C)

220

200

180

Maximum 240˚C

45 (Maximum 70)

Time (seconds)

70 (Maximum 120)

190 (Maximum 300)

Note:

Temperature profile shows printed circuit board surface temperature on the relay terminal portion.

Please consult KEMET if you wish to use a temperature profile other than above.

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

R7001_EA2_EB2 • 2/27/2014 5

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