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CY7C1061DV33-10BV1XI Просмотр технического описания (PDF) - Cypress Semiconductor

Номер в каталоге
Компоненты Описание
производитель
CY7C1061DV33-10BV1XI
Cypress
Cypress Semiconductor Cypress
CY7C1061DV33-10BV1XI Datasheet PDF : 18 Pages
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CY7C1061DV33
Capacitance
Parameter [6]
Description
CIN
COUT
Input Capacitance
I/O Capacitance
Test Conditions
TA = 25 C, f = 1 MHz, VCC = 3.3 V
54-pin TSOP II 48-ball VFBGA Unit
6
8
pF
8
10
pF
Thermal Resistance
Parameter [6]
Description
JA
Thermal resistance
(junction to ambient)
JC
Thermal resistance
(junction to case)
Test Conditions
54-pin TSOP II 48-ball VFBGA Unit
Still air, soldered on a 3 × 4.5 inch, four
layer printed circuit board
24.18
28.37
C/W
5.40
5.79
C/W
AC Test Loads and Waveforms
Figure 5. AC Test Loads and Waveforms [7]
Output
Z0 = 50
(a)
* Capacitive Load Consists
of all Components of the
Test Environment
50
30 pF*
VTH = 1.5 V
3.0 V
90%
GND
10%
Rise Time:
> 1 V/ns
All Input Pulses
(c)
High-Z Characteristics:
3.3 V
R1 317
Output
5 pF*
Including
JIG and
Scope
(b)
R2
351
90%
10%
Fall Time:
> 1 V/ns
Notes
6. Tested initially and after any design or process changes that may affect these parameters.
7.
Valid
VDD,
SRAM operation does not occur
normal SRAM operation begins
until the power supplies have
including reduction in VDD to
reached
the data
trheetemntiinoinm(uVmCCoDpRe,ra2t.i0ngVV) DvoDlt(a3g.0e.V).
100
s
(tpower)
after
reaching
the
minimum
operating
Document Number: 38-05476 Rev. *H
Page 6 of 17
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