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CY7C1061DV33 Просмотр технического описания (PDF) - Cypress Semiconductor

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производитель
CY7C1061DV33
Cypress
Cypress Semiconductor Cypress
CY7C1061DV33 Datasheet PDF : 18 Pages
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CY7C1061DV33
Pin Configurations (continued)
Figure 3. 48-ball VFBGA (8 × 9.5 × 1 mm) Single Chip Enable (-BV1XI) (Top View) [3, 4]
1
2
3
4
56
BLE OE A0 A1 A2 NC
A
I/O8 BHE A3 A4 CE I/O0 B
I/O9 I/O10 A5 A6 I/O1 I/O2 C
VSS I/O11 A17 A7 I/O3 VCC D
VCC I/O12 NC A16 I/O4 VSS E
I/O14 I/O13 A14 A15 I/O5 I/O6 F
I/O15 A19 A12 A13 WE I/O7 G
A18 A8 A9 A10 A11 NC
H
Figure 4. 54-pin TSOP II (22.4 × 11.84 × 1.0 mm) (Top View) [3]
I/O12
1
VCC
2
I/O13
3
I/O14
4
VSS
5
I/O15
6
A4
7
A3
8
A2
9
A1 10
A0 11
BHE 12
CE1 13
VCC 14
WE 15
CE2 16
A19 17
A18 18
A17 19
A16 20
A15 21
I/O0 22
VCC 23
I/O1 24
I/O2 25
VSS 26
I/O3 27
54 I/O11
53
VSS
52 I/O10
51 I/O9
50
VCC
49 I/O8
48 A5
47 A6
46 A7
45 A8
44
A9
43 NC
42 OE
41
VSS
40 NC
39 BLE
38
A10
37
A11
36
A12
35
A13
34
A14
33
I/O7
32
VSS
31
I/O6
30
I/O5
29
VCC
28
I/O4
Notes
3. NC pins are not connected on the die.
4. In BV1XI package, ball A6 is NC, ball H6 is NC and ball G2 is MSB address A19. BV1XI package has only single Chip Enable (CE).
Document Number: 38-05476 Rev. *H
Page 4 of 17
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