BGA2714 Просмотр технического описания (PDF) - NXP Semiconductors.

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производитель

BGA2714

MMIC wideband amplifier

NXP Semiconductors. 

NXP Semiconductors

BGA2714

MMIC wideband amplifier

Table 7. Characteristics …continued

VSUP = 3 V; ISUP = 4.58 mA; Tamb = 25 °C; measured on demo board; unless otherwise specified.

Symbol Parameter

Conditions

Min Typ Max Unit

IP3I

input third-order intercept point

f = 250 MHz

f = 950 MHz

−17.4 −16.4 -

−19.1 −18.3 -

dBm

dBm

f = 2150 MHz

−21.8 −20.8 - dBm

IP3O output third-order intercept point

f = 250 MHz

3.3 4.3 - dBm

f = 950 MHz

1.3 2.1 - dBm

f = 2150 MHz

−1.0 0

- dBm

PL(2H) second harmonic output power

f1H = 250 MHz; −62 −64 -

f2H = 500 MHz;

Pdrive = −40 dBm

f1H = 950 MHz; −58 −60 -

f2H = 1900 MHz;

Pdrive = −40 dBm

∆IM2

second-order intermodulation distance f1 = 250 MHz;

−36 −38 -

f2 = 251 MHz;

Pdrive = −40 dBm

f1 = 950 MHz;

−31 −33 -

f2 = 951 MHz;

Pdrive = −40 dBm

dBm

dBm

dBc

dBc

8. Application information

Figure 1 shows a typical application circuit for the BGA2714 MMIC. The device is

internally matched to 50 Ω, and therefore does not need any external matching. The value

of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF

for applications above 100 MHz. However, when the device is operated below 100 MHz,

the capacitor value should be increased.

The 22 nF supply decoupling capacitor C1 should be located as close as possible to the

MMIC.

The PCB top ground plane, connected to pins 2, 4 and 5 must be as close as possible to

the MMIC, preferably also below the MMIC. When using via holes, use multiple via holes

as close as possible to the MMIC.

VS

C1

C2 RF_IN

RF input

VS

RF_OUT C3

RF output

GND1

GND2

Fig 1. Typical application circuit

001aaf761

BGA2714_1

Product data sheet

Rev. 01 — 24 May 2007

© NXP B.V. 2007. All rights reserved.

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