ADNS-2030 Просмотр технического описания (PDF) - Agilent Technologies, Inc

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производитель

ADNS-2030

Low Power Optical Mouse Sensor

Agilent Technologies, Inc 

SERIAL

PORT

QUADRATURE

OUTPUTS

SCLK

SDIO

XA

XB

YA

YB

SERIAL PORT

OSCILLATOR

POWER ON

RESET

IMAGE

PROCESSOR

OSC_IN

OSC_OUT

RESONATOR

PD

VDD

3.3 VOLT

GND

POWER

GND

PCB motion due to button

presses must be minimized to

maintain optical alignment.

9. Install mouse top case. There

must be a feature in the top

case to press down onto the

clip to ensure all components

are interlocked to the correct

vertical height.

R_BIN

LED

XY_LED

LED

DRIVE

REFA

REFB

VOLTAGE

REFERENCE

Figure 6. Block diagram of ADNS-2030 optical mouse sensor.

PCB Assembly Considerations

1. Insert the sensor and all other

electrical components into

PCB.

2. Bend the LED leads 90° and

then insert the LED into the

assembly clip until the snap

feature locks the LED base.

3. Insert the LED/clip assembly

into PCB.

4. Wave Solder the entire

assembly in a no-wash solder

process utilizing solder

fixture. The solder fixture is

needed to protect the sensor

during the solder process. The

fixture should be designed to

expose the sensor leads to

solder while shielding the

optical aperture from direct

solder contact. The solder

fixture is also used to set the

reference height of the sensor

to the PCB top during wave

soldering (Note: DO NOT

remove the kapton tape during

wave soldering).

5. Place the lens onto the base

plate.

6. Remove the protective kapton

tape from optical aperture of

the sensor. Care must be taken

to keep contaminants from

entering the aperture. It is

recommended not to place the

PCB facing up during the

entire mouse assembly pro-

cess. The PCB should be held

vertically during the kapton

removal process.

7. Insert PCB assembly over the

lens onto the base plate

aligning post. The sensor

aperture ring should self-align

to the lens.

8. The optical position reference

for the PCB is set by the base

plate and lens. Note that the

Design Considerations for Improving

ESD Performance

The flange on the lens has been

designed to increase the creepage

and clearance distance for

electrostatic discharge. The table

below shows typical values

assuming base plate construction

per the Agilent supplied IGES file

and HDNS-2100 lens flange.

Typical Distance

Creepage

Clearance

Millimeters

16.0

2.1

For improved ESD performance,

the lens flange can be sealed (i.e.

glued) to the base plate. Note

that the lens material is polycar-

bonate and therefore, cyanoacry-

late based adhesives or other

adhesives that may damage the

lens should NOT be used.

Sensor

Clip

PCB

Lens/Light Pipe

Base Plate

LED

N

c

o

Surface

Figure 7. PCB assembly.

4

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