RF1K49221(1999) Просмотр технического описания (PDF) - Fairchild Semiconductor
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Компоненты Описание
производитель
RF1K49221
(Rev.:1999)
(Rev.:1999)
Fairchild Semiconductor
RF1K49221 Datasheet PDF : 8 Pages
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RF1K49221
Test Circuits and Waveforms (Continued)
VGS
0V
RGS
RL
+
-
DUT
FIGURE 17. SWITCHING TIME TEST CIRCUIT
VDS
tON
td(ON)
tr
90%
tOFF
td(OFF)
tf
90%
10%
0
VGS
10%
0
50%
PULSE WIDTH
10%
90%
50%
FIGURE 18. RESISTIVE SWITCHING WAVEFORMS
VGS
IG(REF)
VDS
RL
DUT
+
VDD
-
VDD
VDS
Qg(TOT)
VGS
VGS = 2V
Ig(REF)
Qg(10)
Qg(TH)
VGS = 10V
VGS = 20V
FIGURE 19. GATE CHARGE TEST CIRCUIT
FIGURE 20. GATE CHARGE WAVEFORMS
Soldering Precautions
The soldering process creates a considerable thermal stress
on any semiconductor component. The melting temperature
of solder is higher than the maximum rated temperature of
the device. The amount of time the device is heated to a high
temperature should be minimized to assure device reliability.
Therefore, the following precautions should always be
observed in order to minimize the thermal stress to which the
devices are subjected.
1. Always preheat the device.
2. The delta temperature between the preheat and soldering
should always be less than 100oC. Failure to preheat the
device can result in excessive thermal stress which can
damage the device.
3. The maximum temperature gradient should be less than 5oC
per second when changing from preheating to soldering.
4. The peak temperature in the soldering process should be
at least 30oC higher than the melting point of the solder
chosen.
5. The maximum soldering temperature and time must not
exceed 260oC for 10 seconds on the leads and case of
the device.
6. After soldering is complete, the device should be allowed
to cool naturally for at least three minutes, as forced cool-
ing will increase the temperature gradient and may result
in latent failure due to mechanical stress.
7. During cooling, mechanical stress or shock should be
avoided.
©2001 Fairchild Semiconductor Corporation
RF1K49221 Rev. A
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