HT7500(2000) Просмотр технического описания (PDF) - Holtek Semiconductor
Номер в каталоге
Компоненты Описание
производитель
HT7500 Datasheet PDF : 8 Pages
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Pad Assignment
HT7500
33
32 31
30 29
LO W C 1
VSS 2
SC 3
RF 4
RS 5
VDD 6
PSW
7
8 9 10 11
(0 ,0 )
12 13 14
28 27 26 25
24 S C 2
23 S C 1
22 S B 3
21 S B 2
20 S B 1
19 S A 3
18 S A 2
17 S A 1
16
15
Chip size: 129 ´ 120 (mil)2
* The IC substrate should be connected to VDD in the PCB layout artwork.
Pad Coordinates
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
X
-58.61
-58.61
-58.61
-58.61
-58.61
-58.61
-58.61
-57.25
-50.62
-43.99
-37.36
-15.64
-3.19
7.44
26.05
58.48
58.82
Y
18.57
6.16
-1.49
-13.30
-20.95
-33.02
-40.08
-53.63
-53.63
-53.63
-53.63
-53.34
-53.34
-52.66
-52.66
-48.75
-7.14
Pin No.
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
X
58.82
58.82
58.82
58.82
58.82
58.82
58.82
46.24
38.59
31.96
24.82
7.39
-0.43
-14.28
-23.63
-42.33
Unit: mil
Y
0.51
8.24
15.90
23.63
31.28
39.01
46.67
54.06
54.06
54.06
54.06
54.06
53.29
53.29
53.29
53.29
2
August 8, 2000
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