CXD1177 Просмотр технического описания (PDF) - Harris Semiconductor
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CXD1177 Datasheet PDF : 2 Pages
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HI1177, CXD1177
Metric Plastic Quad Flatpack Packages (MQFP)
E E1
PIN 1
-H-
0o-10o
D
D1
0.24 M
A1
e
SEATING
A PLANE
0.10
0.004
-C-
B
Q32.7x7-S
32 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.054 0.072 1.35
1.85
-
A1
0.000 0.011 0.00
0.30
-
B
0.008 0.017 0.20
0.45
5
D
0.347 0.362 8.80
9.20
2
D1
0.272 0.287 6.90
7.30
3, 4
E
0.347 0.362 8.80
9.20
2
E1
0.272 0.287 6.90
7.30
3, 4
L
0.012 0.027 0.30
0.70
-
N
32
32
6
e
0.032 BSC
0.80 BSC
-
Rev. 2 4/95
NOTES:
1. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
2. Dimensions D and E to be determined at seating plane -C- .
3. Dimensions D1 and E1 to be determined at datum plane -H- .
4. Dimensions D1 and E1 do not include mold protrusion.
5. Dimension B does not include dambar protrusion.
6. “N” is the number of terminal positions.
L
0.077/0.227
0.003/0.009
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