TGC1430F Просмотр технического описания (PDF) - TriQuint Semiconductor
Номер в каталоге
Компоненты Описание
производитель
TGC1430F Datasheet PDF : 4 Pages
| |||
Product Data Sheet
August 5, 2008
TGC1430F
Mechanical Drawing
1.49 [0.059]
.84 [0.033]
1
2
1.12 [0.044]
.00 [0.000]
Units: millimeters [inches]
Thickness: 0.10 [0.004] (reference only)
Chip edge to bond pad dimensions are shown to center of bond pads.
Chip size tolerance: ±0.05 [0.002]
RF ground through backside
Bond Pad #1
Bond Pad #2
RF Input
RF Output
0.10 x 0.20
0.10 x 0.20
[0.004 x 0.008]
[0.004 x 0.008]
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
2
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com
Share Link: 