NXP Semiconductors
1PS70SB14
Dual Schottky barrier diode
1.425
(3×)
4.6
2.575
3.65 2.1
Fig. 6. Wave soldering footprint for SC-70 (SOT323)
1.8
09
(2×)
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot323_fw
14. Revision history
Table 8. Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
1PS70SB14 v.2
20121217
Product data sheet
-
1PS70SB10_14_15_16
v.1
Modifications:
• The format of this document has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Sections 1 to 3 updated
• Section 4 "Quick reference data" added
• Section 6 "Ordering information" added
• Section 7 "Marking" updated
• Table 5 "Limiting values": ambient temperature Tamb and junction temperature Tj updated
• Figues 1, 2 and 3 updated
• Section 11 "Test information" added
• Figure 4: superseded by minimized package outline drawing
• Section 13 "Soldering" added
• Section 14 "Legal information" updated
1PS70SB10_14_15_16 19990426
Product data sheet
-
-
v.1
1PS70SB14
Product data sheet
All information provided in this document is subject to legal disclaimers.
17 December 2012
© NXP B.V. 2012. All rights reserved
6/9