A14100 Просмотр технического описания (PDF) - Microsemi Corporation

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A14100

Accelerator Series FPGAs – ACT 3 Family

Microsemi Corporation 

Accelerator Series FPGAs – ACT 3 Family

Ordering Information

A14100

A _1

RQ

G

208

C

Application (Temperature Range)

C = Commercial (0 to +70°C)

I = Industrial (–40 to +85°C)

M = Military (–55 to +125°C)

B = MIL-STD-883

Package Lead Count

Lead-Free Packaging

Blank = Standard Packaging

G = RoHS Compliant Packaging

Package Type

PG = Ceramic Pin Grid Array

PL = Plastic Leaded Chip Carrier

PQ = Plastic Quad Flatpack

RQ = Plastic Power Quad Flatpack

VQ = Very Thin (1.0 mm) Quad Flatpack

TQ = Thin (1.4 mm) Quad Flatpack

CQ = Ceramic Quad Flatpack

BG = Plastic Ball Grid Array

Speed Grade

Std = Standard Speed

–1 = Approximately 15% faster than Standard

–2 = Approximately 25% faster than Standard

–3 = Approximately 35% faster than Standard

Die Revision

A = 1.0 mm CMOS Process

Part Number

A1415A = 1,500 Gates

A14V15A = 1,500 Gates (3.3 V)

A1425A = 2,500 Gates

A14V25A = 2,500 Gates (3.3 V)

A1440A = 4,000 Gates

A14V40A = 4,000 Gates (3.3 V)

A1460A = 6,000 Gates

A14V60A = 6,000 Gates (3.3 V)

A14100A = 10,000 Gates

A14V100A = 10,000 Gates (3.3 V)

Notes:

1. The –2 and –3 speed grades have been discontinued.

2. The Ceramic Pin Grid Array packages PG100, PG133, and PG175 have been discontinued in all device densities, speed

grades, and temperature grades.

3. The Plastic Ball Grid Array package BG225 has been discontinued in all device densities (specifically for A1460A), all speed

grades, and all temperature grades.

4. Military Grade devices are no longer available for the A1440A device.

5. For more information about discontinued devices, refer to the Product Discontinuation Notices (PDNs) listed below, available on

the Microsemi SoC Products Group website:

PDN March 2001

PDN 0104

PDN 0203

PDN 0604

PDN 1004

II

Revision 3

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