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STPS2L40(2007) Просмотр технического описания (PDF) - STMicroelectronics

Номер в каталоге
Компоненты Описание
производитель
STPS2L40
(Rev.:2007)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STPS2L40 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
Package Information
STPS2L40
Table 5. SMB Flat dimensions
Dimensions
Ref. Millimeters
Inches
A
D
L
E E1
L
b
Min. Typ. Max. Min. Typ. Max.
c
A 0.90
1.10 0.035
0.043
b(1) 1.95
2.20 0.077
0.087
L2 c(1) 0.15
D 3.30
0.40 0.006
3.95 0.130
0.016
0.156
E 5.10
5.60 0.200
0.220
L1 E1 4.05
L 0.75
4.60 0.189
1.50 0.029
0.181
0.059
L1
0.40
L2
0.60
0.016
0.024
1. Applies to plated leads
Figure 16. SMB Flat footprint (dimensions in mm)
5.84
2.07
1.20
3.44
1.20
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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