PK10FN32VMC7 Просмотр технического описания (PDF) - NXP Semiconductors.
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PK10FN32VMC7 Datasheet PDF : 75 Pages
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Table of Contents
1 Ordering parts...........................................................................3
5.4.2 Thermal attributes.................................................21
1.1 Determining valid orderable parts......................................3
6 Peripheral operating requirements and behaviors....................22
2 Part identification......................................................................3
6.1 Core modules....................................................................22
2.1 Description.........................................................................3
6.1.1 Debug trace timing specifications.........................22
2.2 Format...............................................................................3
6.1.2 JTAG electricals....................................................23
2.3 Fields.................................................................................3
6.2 System modules................................................................26
2.4 Example............................................................................4
6.3 Clock modules...................................................................26
3 Terminology and guidelines......................................................4
6.3.1 MCG specifications...............................................26
3.1 Definition: Operating requirement......................................4
6.3.2 Oscillator electrical specifications.........................28
3.2 Definition: Operating behavior...........................................5
6.3.3 32 kHz oscillator electrical characteristics.............30
3.3 Definition: Attribute............................................................5
6.4 Memories and memory interfaces.....................................31
3.4 Definition: Rating...............................................................6
6.4.1 Flash electrical specifications................................31
3.5 Result of exceeding a rating..............................................6
6.4.2 EzPort switching specifications.............................33
3.6 Relationship between ratings and operating
6.4.3 Flexbus switching specifications...........................34
requirements......................................................................6
6.5 Security and integrity modules..........................................37
3.7 Guidelines for ratings and operating requirements............7
6.6 Analog...............................................................................37
3.8 Definition: Typical value.....................................................7
6.6.1 ADC electrical specifications.................................37
3.9 Typical value conditions....................................................8
6.6.2 CMP and 6-bit DAC electrical specifications.........45
4 Ratings......................................................................................9
6.6.3 12-bit DAC electrical characteristics.....................48
4.1 Thermal handling ratings...................................................9
6.6.4 Voltage reference electrical specifications............51
4.2 Moisture handling ratings..................................................9
6.7 Timers................................................................................52
4.3 ESD handling ratings.........................................................9
6.8 Communication interfaces.................................................52
4.4 Voltage and current operating ratings...............................9
6.8.1 CAN switching specifications................................52
5 General.....................................................................................10
6.8.2 DSPI switching specifications (limited voltage
5.1 AC electrical characteristics..............................................10
range)....................................................................53
5.2 Nonswitching electrical specifications...............................10
6.8.3 DSPI switching specifications (full voltage range).54
5.2.1 Voltage and current operating requirements.........10
6.8.4 Inter-Integrated Circuit Interface (I2C) timing........56
5.2.2 LVD and POR operating requirements.................11
6.8.5 UART switching specifications..............................57
5.2.3 Voltage and current operating behaviors..............12
6.8.6 SDHC specifications.............................................57
5.2.4 Power mode transition operating behaviors..........14
6.8.7 I2S/SAI switching specifications............................58
5.2.5 Power consumption operating behaviors..............15
6.9 Human-machine interfaces (HMI)......................................64
5.2.6 EMC radiated emissions operating behaviors.......18
6.9.1 TSI electrical specifications...................................64
5.2.7 Designing with radiated emissions in mind...........19
7 Dimensions...............................................................................65
5.2.8 Capacitance attributes..........................................19
7.1 Obtaining package dimensions.........................................65
5.3 Switching specifications.....................................................19
8 Pinout........................................................................................65
5.3.1 Device clock specifications...................................19
8.1 K10 signal multiplexing and pin assignments....................65
5.3.2 General switching specifications...........................20
8.2 K10 pinouts.......................................................................69
5.4 Thermal specifications.......................................................21
9 Revision history.........................................................................70
5.4.1 Thermal operating requirements...........................21
K10 Sub-Family Data Sheet, Rev. 3, 6/2013.
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Freescale Semiconductor, Inc.
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