BAP50-03 Просмотр технического описания (PDF) - NXP Semiconductors.
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Компоненты Описание
производитель
BAP50-03 Datasheet PDF : 7 Pages
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NXP Semiconductors
7. Package outline
Plastic surface-mounted package; 2 leads
D
A
BAP50-03
General purpose PIN diode
SOD323
E
X
HD
vM A
1
(1)
2
bp
A
A1
detail X
Q
c
Lp
0
1
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E HD Lp Q
v
mm
1.1
0.8
0.05
0.40
0.25
0.25
0.10
1.8
1.6
1.35
1.15
2.7
2.3
0.45 0.25
0.15 0.15
0.2
Note
1. The marking bar indicates the cathode
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOD323
SC-76
2 mm
Fig 5. Package outline SOD323
BAP50-03_4
Product data sheet
Rev. 04 — 11 September 2009
EUROPEAN
PROJECTION
ISSUE DATE
03-12-17
06-03-16
© NXP B.V. 2009. All rights reserved.
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