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74LVC245AD(2009) Просмотр технического описания (PDF) - NXP Semiconductors.

Номер в каталоге
Компоненты Описание
производитель
74LVC245AD
(Rev.:2009)
NXP
NXP Semiconductors. NXP
74LVC245AD Datasheet PDF : 17 Pages
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NXP Semiconductors
74LVC245A; 74LVCH245A
Octal bus transceiver; 3-state
8. Recommended operating conditions
Table 5.
Symbol
VCC
VI
VO
Tamb
t/V
Recommended operating conditions
Parameter
Conditions
supply voltage
maximum speed
performance
functional
input voltage
output voltage
output HIGH or LOW
output 3-state
ambient temperature
in free air
input transition rise and fall rate
VCC = 1.2 V to 2.7 V
VCC = 2.7 V to 3.6 V
9. Static characteristics
Min Typ Max
Unit
2.7
-
3.6
V
1.2
-
0
-
0
-
0
-
40 -
0
-
0
-
3.6
5.5
VCC
5.5
+125
20
10
V
V
V
V
°C
ns/V
ns/V
Table 6. Static characteristics
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
40 °C to +85 °C
Min Typ[1] Max
VIH
HIGH-level input VCC = 1.2 V
voltage
VCC = 2.7 V to 3.6 V
VCC
-
-
2.0
-
-
VIL
LOW-level input VCC = 1.2 V
voltage
VCC = 2.7 V to 3.6 V
-
-
0
-
-
0.8
VOH
HIGH-level output VI = VIH or VIL
voltage
IO = 100 µA;
VCC = 2.7 V to 3.6 V
VCC 0.2 VCC
-
IO = 12 mA; VCC = 2.7 V
2.2
-
-
IO = 18 mA; VCC = 3.0 V
2.4
-
-
IO = 24 mA; VCC = 3.0 V
2.2
-
-
VOL
LOW-level output VI = VIH or VIL
voltage
IO = 100 µA;
VCC = 2.7 V to 3.6 V
-
0 0.20
IO = 12 mA; VCC = 2.7 V
-
- 0.40
IO = 24 mA; VCC = 3.0 V
-
- 0.55
II
input leakage
VI = 5.5 V or GND; VCC = 3.6 V [2]
-
±0.1 ±5
current
IOZ
OFF-state output VI = VIH or VIL;
current
VO = 5.5 V or GND;
VCC = 3.6 V
[2][3]
-
IOFF
power-off leakage VI or VO = 5.5 V; VCC = 0.0 V
-
current
±0.1 ±5
±0.1 ±10
ICC
ICC
supply current
additional supply
current
VI = VCC or GND; IO = 0 A;
VCC = 3.6 V
per input pin; VI = VCC 0.6 V;
IO = 0 A; VCC = 2.7 V to 3.6 V
-
0.1 10
-
5
500
40 °C to +125 °C Unit
Min
Max
VCC
-V
2.0
-V
-
0V
-
0.8 V
VCC 0.3
2.05
2.25
2.0
-V
-V
-V
-V
-
0.3 V
-
0.6 V
-
0.8 V
-
±20 µA
-
±20 µA
-
±20 µA
-
40 µA
-
5000 µA
74LVC_LVCH245A_5
Product data sheet
Rev. 05 — 25 August 2009
© NXP B.V. 2009. All rights reserved.
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