RF2138 Просмотр технического описания (PDF) - RF Micro Devices
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RF2138 Datasheet PDF : 10 Pages
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RF2138
Pin Function Description
Interface Schematic
1
NC
Not connected. Connect this pin to the ground plane for compatibility
with future packages.
2
GND2
Ground connection for the driver stage. To minimize the noise power at See pin 15.
the output, it is recommended to connect this pin with a trace of about
40mil to the ground plane. This will slightly reduce the small signal
gain, and lower the noise power. It is important for stability that this pin
2
have it’s own vias to the ground plane, minimizing common inductance.
3
RF IN
RF Input. This is a 50Ω input, but the actual impedance depends on the
VCC1
interstage matching network connected to pin 5. An external DC block-
ing capacitor is required if this port is connected to a DC path to ground
or a DC voltage.
RF IN
From Bias
Stages GND1
4
GND1
Ground connection for the pre-amplifier stage. Keep traces physically See pin 3.
short and connect immediately to the ground plane for best perfor-
mance. It is important for stability that this pin has it’s own vias to the
groundplane, to minimize any common inductance.
5
VCC1
Power supply for the pre-amplifier stage and interstage matching. This See pin 3.
pin forms the shunt inductance needed for proper tuning of the inter-
stage match. Refer to the application schematic for proper configura-
tion. Note that position and value of the components are important.
6
APC1
Power Control for the driver stage and pre-amplifier. When this pin is
"low," all circuits are shut off. A "low" is typically 0.5V or less at room
APC VCC
temperature. A shunt bypass capacitor is required. During normal oper-
ation this pin is the power control. Control range varies from about 1.0V
for -10dBm to 2.6V for +35dBm RF output power. The maximum power
that can be achieved depends on the actual output matching; see the
application information for more details. The maximum current into this
To RF
Stages
pin is 5mA when VAPC1=2.6V, and 0mA when VAPC=0V.
GND
GND
7
APC2
Power Control for the output stage. See pin 6 for more details.
See pin 6.
8
VCC
Power supply for the bias circuits.
See pin 6.
9
NC
Not connected. Connect this pin to the ground plane for compatibility
with future packages.
10
RF OUT RF Output and power supply for the output stage. Bias voltage for the
final stage is provided through this wide output pin. An external match-
ing network is required to provide the optimum load impedance.
RF OUT
11
12
13
14
15
16
Pkg
Base
RF OUT
RF OUT
2F0
NC
VCC2
VCC2
GND
From Bias
Stages GND
PCKG BASE
Same as pin 10.
Same as pin 10.
Same as pin 10.
Same as pin 10.
Connection for the second harmonic trap. This pin is internally con-
nected to the RF OUT pins. The bonding wire together with an external
capacitor form a series resonator that should be tuned to the second
harmonic frequency in order to increase efficiency and reduce spurious
outputs.
Not connected.
Same as pin 10.
Power supply for the driver stage and interstage matching. This pin
forms the shunt inductance needed for proper tuning of the interstage
match. Please refer to the application schematic for proper configura-
tion, and note that position and value of the components are important.
VCC2
From Bias
Stages GND2
Same as pin 15.
Same as pin 15.
Ground connection for the output stage. This pad should be connected
to the ground plane by vias directly under the device. A short path is
required to obtain optimum performance, as well as to provide a good
thermal path to the PCB for maximum heat dissipation.
2-122
Rev A9 011031
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