C430 Просмотр технического описания (PDF) - KEMET
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C430 Datasheet PDF : 15 Pages
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Axial Leaded Multilayer Ceramic Capacitors
Aximax, 400 Series, Conformally Coated, C0G Dielectric, 50 – 200 VDC (Commercial Grade)
Table 2 – Performance & Reliability: Test Methods and Conditions
Stress
Solderability
Temperature Cycling
Reference
J-STD-002
JESD22 Method JA-104
Biased Humidity MIL-STD-202 Method 103
Moisture Resistance MIL-STD-202 Method 106
Thermal Shock MIL-STD-202 Method 107
High Temperature Life
MIL-STD-202 Method 108
/ EIA -198
Storage Life
MIL-STD-202 Method 108
Vibration
MIL-STD-202 Method 204
Resistance to Soldering
Heat
MIL-STD-202 Method 210
Terminal Strength MIL-STD-202 Method 211
Test or Inspection Method
Magnification 50X. Conditions:
a) Method A, at 235°C, Category 3
5 cycles (−55°C to +125°C), measurement at 24 hours +/−4 hours after test conclusion.
Load humidity, 1,000 hours 85°C/85%RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours +/−4 hours after test conclusion.
Low volt humidity, 1,000 hours 85C°/85%RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/−4 hours after test conclusion.
t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered. Measurement at 24 hours +/−4
hours after test conclusion.
−55ºC to +125°C. Note: Number of cycles required = 300. Maximum transfer time = 20
seconds. Dwell time -15 minutes. Air – Air.
1,000 hours at 125°C (85°C for Z5U) with 1 X rated voltage applied.
125°C, 0 VDC for 1,000 hours.
5 g for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8"X5" PCB .031" thick 7
secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10-2000 Hz.
Condition B. No preheat of samples. Note: single wave solder – procedure 2.
Conditions A (454g), Condition C (227g)
Mechanical Shock MIL-STD-202 Method 213 Figure 1 of Method 213, Condition C.
Resistance to Solvents MIL-STD-202 Method 215 Add aqueous wash chemical – OKEM Clean or equivalent.
Storage & Handling
The un-mounted storage life of a leaded ceramic capacitor is dependent upon storage and atmospheric conditions as
well as packaging materials. While the ceramic chips enveloped under the epoxy coating themselves are quite robust
in most environments, solderability of the wire lead on the final epoxy-coated product will be degraded by exposure to
high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be
degraded by high temperature and exposure to direct sunlight–reels may soften or warp, and tape peel force may increase.
KEMET recommends storing the un-mounted capacitors in their original packaging, in a location away from direct sunlight,
and where the temperature and relative humidity do not exceed 40 degrees centigrade and 70% respectively. For optimum
solderability, capacitor stock should be used promptly, preferably within 18 months of receipt. For applications requiring
pre-tinning of components, storage life may be extended if solderability is verified. Before cleaning, bonding or molding these
devices, it is important to verify that your process does not affect product quality and performance. KEMET recommends
testing and evaluating the performance of a cleaned, bonded or molded product prior to implementing and/or qualifying any
of these processes.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1040_AXIMAX_C0G • 12/5/2016 11
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