BA5830FM Просмотр технического описания (PDF) - ROHM Semiconductor

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BA5830FM

Power driver for compact disc player

ROHM Semiconductor 

4/4

○ Notes on use

(1) Drivers can be switched mute ON/OFF by inputting combinations of H-level signal and L-level signal to MUTE and CNT terminal.

There is the logic diagram in under table.（SL:Sled、LD:Loading）

INPUT

OUTPUT

MUTE CNT

CH1~3

CH4

H

H

MUTE OFF

LD ON

H

L

MUTE OFF

SL ON

L

H

MUTE ON

LD ON

L

L

MUTE ON

MUTE ON

(2) When the BIAS terminal (27PIN) is lowered below 0.7V(typ.), the output is muted. In the normal state, this PIN must be pulled up above

1.3V. (When CNT is ’H’, CH4 isn’t muted.)

(3) When the supply voltage reaches 3.8V (typ.) or lower, the output current is muted.

When it rises to 4.0V (typ.) again, the driver circuit is activated.

(4) The output is muted in the event of a thermal shut down, mute-on, or bias and Pre Vcc voltage drop. Only the driver is

muted. When muted, output terminal becomes internal reference voltage (about (PowVcc-Vf)/2).

(5) When a capacitance load is connected to the OP amplifier output, the amplifier phase margin decreases,

which causes the peak or oscillator..When connecting such load, insert a resistance in series between the output and

the capacitance load and take a full consideration for frequency characteristics, to prevent problems during practical use.

(6) Connect a coupling capacitor (approx 0.1µF) between the power supplies at the root of this IC.

(7) Connect the radiation fin to the external GND.

(8) Avoid the short-circuits between: Output pin and Vcc、Output pin and GND、Output pins

If this caution is ignored, IC damage may cause smokes.

(9) About absolute maximum ratings

Exceeding the absolute maximum ratings, such as the applied voltage or the operating temperature range, may cause permanent

device damage. As these cases cannot be limited to the broken short mode or the open mode, if a special mode where the absolute

maximum ratings may be exceeded is assumed, it is recommended to take mechanical safety measures such as attaching fuses.

(10) About power supply lines

As a measure against the back current regenerated by a counter electromotive force of the motor, a capacitor to be used as a

regenerated-current path can be installed between the power supply and GND and its capacitance value should be determined after

careful check that any problems, for example, a leak capacitance of the electrolytic capacitor at low temperature, are not found in various

characteristics.

(11) About GND potential

The electric potential of the GND terminal must be kept lowest in the circuitry at any operation states.

(12) About thermal design

With consideration of the power dissipation (Pd) under conditions of actual use, a thermal design provided with an enough margin should

be done.

(13) About operations in a strong electric field. When used in a strong electric field, note that a malfunction may occur.

(14) ASO

When using this IC, the output Tr must be set not to exceed the values specified in the absolute maximum ratings and ASO.

(15) Thermal shutdown circuit

This IC incorporates a thermal shutdown circuit (TSD circuit). When the chip temperature reaches the value shown below, the coil output to

the motor will be set to open.

The thermal shutdown circuit is designed only to shut off the IC from a thermal runaway and not intended to

protect or guarantee the entire IC functions.Therefore, users cannot assume that the TSD circuit once activated

can be used continuously in the subsequent operations.

TSD ON Temperature [℃]（typ.） Hysteresis Temperature [℃]（typ.）

175

25

(16) About earth wiring patterns

When a small signal GND and a large current GND are provided, it is recommended that the large current GND pattern and the small

signal GND pattern should be separated and grounded at a single point of the reference point of the set in order to prevent the voltage

of the small signal GND from being affected by a voltage change caused by the resistance of the pattern wiring and the large current.

Make sure that the GND wiring patterns of the external components will not change, too.

(17) About each input terminal

This IC is a monolithic IC which has a P+ isolations and P substrate to isolate elements each other.

This P layer and an N layer in each element form a PN junction to construct various parasitic elements.

Due to the IC structure, the parasitic elements are inevitably created by the potential relationship.

Activation of the parasitic elements can cause interference between circuits and may result in a malfunction or, consequently, a fatal damage.

Therefore, make sure that the IC must not be used under conditions that may activate the parasitic elements, for example, applying the lower

voltage than the ground level(GND, P substrate) to the input terminals.

Note that, while not applying the power supply voltage to the IC, any voltage must not be applied to the input terminals. In addition,

do not apply the voltage to input terminals without applying the power supply voltage to the IC. Also while applying the power supply voltage,

each input terminal must be the power supply voltage or less; or within the guaranteed values in the electric characteristics.

REV. A

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