LM358_ Просмотр технического описания (PDF) - First Components International
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LM358_ Datasheet PDF : 5 Pages
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LM358 Low Power Dual Operational Amplifier
CHIP DIAGRAM
1.21 ±0.03
07 06
05
Chip marking
15T57
(x=1.028, y=1.374)
08
04
02
03
(0,0)
Pad size 0.11 x 0.11 mm (Pad size is given as per passivation layer)
Thickness of chip 0.35 ± 0.02 mm
Pad No
01
02
03
04
05
06
07
08
PAD LOCATION
Symbol
X
OUT1
IN1(-)
IN1(+0
GND
IN2(+)
IN2(-)
OUT2
VCC
0.087
0.267
0.852
1.003
0.852
0.267
0.087
0.087
Y
0.085
0.085
0.085
0.695
1.305
1.305
1.305
0.695
5
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