MC100LVE222FAR2G Просмотр технического описания (PDF) - ON Semiconductor
Номер в каталоге
Компоненты Описание
производитель
MC100LVE222FAR2G Datasheet PDF : 8 Pages
| |||
MC100LVE222
PACKAGE DIMENSIONS
FA SUFFIX
LQFP PACKAGE
CASE 848D−03
ISSUE D
4X
0.20 (0.008) H L−M N
4X 13 TIPS
0.20 (0.008) T L−M N
52
1
40
39
CL
AB
−X−
X=L, M, N
G
−L−
13
14
A1
S1
C
−H−
−T−
SEATING
PLANE
3X VIEW Y
−N−
27
26
A
S
4X q2
4X q3
−M−
BV
B1 V1
AB
VIEW Y
PLATING
F
BASE METAL
JÉÉÇÇÉÉÇÇÉÉÇÇÉÉ U
D
0.13 (0.005) M T L−M S N S
SECTION AB−AB
ROTATED 90° CLOCKWISE
0.05 (0.002) S
C2
0.10 (0.004) T
VIEW AA
C1
VIEW AA
W
q1
q
K
E
Z
2X R R1
0.25 (0.010)
GAGE PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE −H− IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS −L−, −M− AND −N− TO BE DETERMINED
AT DATUM PLANE −H−.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE −T−.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 10.00 BSC
0.394 BSC
A1 5.00 BSC
0.197 BSC
B 10.00 BSC
0.394 BSC
B1 5.00 BSC
0.197 BSC
C −−− 1.70 −−− 0.067
C1 0.05 0.20 0.002 0.008
C2 1.30 1.50 0.051 0.059
D 0.20 0.40 0.008 0.016
E 0.45 0.75 0.018 0.030
F 0.22 0.35 0.009 0.014
G
0.65 BSC
0.026 BSC
J 0.07 0.20 0.003 0.008
K
0.50 REF
0.020 REF
R1 0.08 0.20 0.003 0.008
S 12.00 BSC
0.472 BSC
S1 6.00 BSC
0.236 BSC
U 0.09 0.16 0.004 0.006
V 12.00 BSC
0.472 BSC
V1
6.00 BSC
0.236 BSC
W
0.20 REF
0.008 REF
Z
1.00 REF
0.039 REF
θ 0_ 7_
θ1 0_ −−−
θ2
12_ REF
θ3
12_ REF
0_ 7_
0_ −−−
12_ REF
12_ REF
http://onsemi.com
7
Share Link: 