LE82Q965SLJAC Просмотр технического описания (PDF) - Intel
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LE82Q965SLJAC Datasheet PDF : 402 Pages
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7.1.4
7.1.5
7.1.6
7.1.7
7.1.8
7.1.9
7.1.10
7.1.11
7.1.12
7.1.13
DMIPVCCTL—DMI Port VC Control............................................ 224
DMIVC0RCAP—DMI VC0 Resource Capability ............................. 224
DMIVC0RCTL0—DMI VC0 Resource Control ............................... 225
DMIVC0RSTS—DMI VC0 Resource Status .................................. 226
DMIVC1RCAP—DMI VC1 Resource Capability ............................. 226
DMIVC1RCTL1—DMI VC1 Resource Control ............................... 227
DMIVC1RSTS—DMI VC1 Resource Status .................................. 228
DMILCAP—DMI Link Capabilities .............................................. 228
DMILCTL—DMI Link Control .................................................... 229
DMILSTS—DMI Link Status ..................................................... 230
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Integrated Graphics Device Registers (Device 2) (Intel® 82Q965/82Q963/82G965
Only) .......................................................................................................... 231
8.1 IGD Configuration Register Details (Device 2, Function 0) ........................ 231
8.1.1 VID2—Vendor Identification .................................................... 233
8.1.2 DID2—Device Identification .................................................... 233
8.1.3 PCICMD2—PCI Command ....................................................... 234
8.1.4 PCISTS2—PCI Status ............................................................. 235
8.1.5 RID2—Revision Identification .................................................. 236
8.1.6 CC—Class Code..................................................................... 236
8.1.7 CLS—Cache Line Size............................................................. 237
8.1.8 MLT2—Master Latency Timer................................................... 237
8.1.9 HDR2—Header Type .............................................................. 237
8.1.10 GTTMMADR—Graphics Translation Table, Memory Mapped Range
Address ............................................................................... 238
8.1.11 GMADR—Graphics Memory Range Address ................................ 239
8.1.12 IOBAR—IO Base Address ........................................................ 240
8.1.13 SVID2—Subsystem Vendor Identification .................................. 240
8.1.14 SID2—Subsystem Identification .............................................. 241
8.1.15 ROMADR—Video BIOS ROM Base Address ................................. 241
8.1.16 CAPPOINT—Capabilities Pointer ............................................... 242
8.1.17 INTRLINE—Interrupt Line ....................................................... 242
8.1.18 INTRPIN—Interrupt Pin .......................................................... 242
8.1.19 MINGNT—Minimum Grant ....................................................... 243
8.1.20 MAXLAT—Maximum Latency ................................................... 243
8.1.21 MCAPPTR—Mirror of Device 0 Capabilities Pointer....................... 243
8.1.22 CAPID0—Mirror of Device 0 Capability Identifier ........................ 244
8.1.23 MGGC—Mirror of Device 0 GMCH Graphics Control Register ......... 245
8.1.24 DEVEN—Mirror of Device 0 Device Enable ................................. 246
8.1.25 SSRW—Software Scratch Read Write........................................ 247
8.1.26 BSM—Base of Stolen Memory.................................................. 248
8.1.27 HSRW—Hardware Scratch Read Write ...................................... 248
8.1.28 MSI_CAPID—Message Signaled Interrupts Capability ID .............. 249
8.1.29 MC—Message Control............................................................. 249
8.1.30 MA—Message Address............................................................ 250
8.1.31 MD—Message Data ................................................................ 250
8.1.32 GDRST—Graphics Reset ......................................................... 251
8.1.33 PMCAPID—Power Management Capabilities ID ........................... 252
8.1.34 PMCAP—Power Management Capabilities .................................. 252
8.1.35 PMCS—Power Management Control/Status ................................ 253
8.1.36 SWSMI—Software SMI ........................................................... 254
8.2 IGD Configuration Register Details (Device 2, Function 1) ........................ 255
8.2.1 VID2—Vendor Identification .................................................... 256
8.2.2 DID2—Device Identification .................................................... 256
8.2.3 PCICMD2—PCI Command ....................................................... 257
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Datasheet
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