SK22 Просмотр технического описания (PDF) - Cystech Electonics Corp.
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SK22 Datasheet PDF : 6 Pages
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CYStech Electronics Corp.
SMA/DO-214AC Dimension
Spec. No. : C753SA
Issued Date : 2006.07.13
Revised Date :2013.05.22
Page No. : 6/6
Marking :
Device SK22SA SK24SA SK26SA
Code SK22 SK24 SK26
Device SK28SA SK2BSA
Code SK28 SK2B
SMA/DO-214AC Plastic
Surface Mounted Package
CYStek Package Code : SA
DIM
Inches
Min. Max.
A 0.055 0.062
B 0.098 0.114
C 0.157 0.181
D 0.078 0.096
Millimeters
Min. Max.
1.40 1.60
2.50 2.90
4.00 4.60
2.00 2.44
*:Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
E 0.006 0.012 0.152 0.305
F 0.002 0.008 0.051 0.203
G 0.030 0.060 0.76 1.52
H 0.188 0.208 4.80 5.28
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
SK2XSA
CYStek Product Specification
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