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ICL7660A Просмотр технического описания (PDF) - Intersil

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Компоненты Описание
производитель
ICL7660A
Intersil
Intersil Intersil
ICL7660A Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ICL7660S, ICL7660A
Ordering Information
PART NUMBER
(NOTE 3)
PART MARKING
TEMP. RANGE
(°C)
PACKAGE
PKG. DWG. #
ICL7660SCBA (Note 1)
7660 SCBA
0 to +70
8 Ld SOIC
M8.15
ICL7660SCBAZ
(Notes 1, 2)
7660 SCBAZ
0 to +70
8 Ld SOIC (Pb-free)
M8.15
ICL7660SCPA
7660S CPA
0 to +70
8 Ld PDIP
E8.3
ICL7660SCPAZ (Note 2) 7660S CPAZ
0 to +70
8 Ld PDIP (Pb-free; Note 4)
E8.3
ICL7660SIBA (Note 1)
7660 SIBA
-40 to +85
8 Ld SOIC
M8.15
ICL7660SIBAZ
(Notes 1, 2)
7660 SIBAZ
-40 to +85
8 Ld SOIC (Pb-free)
M8.15
ICL7660SIPA
7660 SIPA
-40 to +85
8 Ld PDIP
E8.3
ICL7660SIPAZ
(Note 2)
7660S IPAZ
-40 to +85
8 Ld PDIP (Pb-free; Note 4)
E8.3
ICL7660ACBA (Note 1)
7660ACBA
0 to 70
8 Ld SOIC (N)
M8.15
ICL7660ACBAZA
(Notes 1, 2)
7660ACBAZ
0 to 70
8 Ld SOIC (N) (Pb-free)
M8.15
ICL7660ACPA
7660ACPA
0 to 70
8 Ld PDIP
E8.3
ICL7660ACPAZ (Note 2) 7660ACPAZ
0 to 70
8 Ld PDIP (Pb-free; Note 4)
E8.3
ICL7660AIBA (Note 1)
7660AIBA
-40 to 85
8 Ld SOIC (N)
M8.15
ICL7660AIBAZA
(Notes 1, 2)
7660AIBAZ
-40 to 85
8 Ld SOIC (N) (Pb-free)
M8.15
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ICL7660S, ICL7660A. For more information on MSL, please see
Tech Brief TB363.
4. Pb-free PDIPs can be used for through-hole wave solder processing only. They are not intended for use in reflow solder processing applications.
2
FN3179.7
January 23, 2013

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