CYUSB3302 Просмотр технического описания (PDF) - Cypress Semiconductor

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CYUSB3302

HX3 USB 3.0 Hub

Cypress Semiconductor 

CYUSB330x

CYUSB331x

CYUSB332x

HX3 USB 3.0 Hub

General Description

HX3 is a family of USB 3.0 hub controllers compliant with the USB 3.0 specification revision 1.0. HX3 supports SuperSpeed (SS),

Hi-Speed (HS), Full-Speed (FS), and Low-Speed (LS) on all the ports. It has integrated termination, pull-up, and pull-down resistors,

and supports configuration options through pin-straps to reduce the overall BOM of the system.

HX3 includes the following Cypress-proprietary features:

Shared Link™: Enables extra downstream (DS) ports for on-board connections in embedded applications

Ghost Charge™: Enables charging of devices connected to the DS ports when no host is connected on the upstream (US) port

HX3 USB 3.0 Hub

Features

USB 3.0-Certified Hub, TID# 330000047

Supports up to Four USB 3.0-Compliant DS ports

■ All ports support SS (5 Gbps), and are backward-compatible

with HS (480 Mbps), FS (12 Mbps), and LS (1.5 Mbps)

■ SS and USB 2.0 Link Power Management (LPM)

■ Dedicated Hi-Speed Transaction Translators (Multi-TT)

■ LED status indicators – suspend, SS, and USB 2.0 operation

Shared Link™ for Embedded Applications

■ Each DS port can simultaneously connect to an embedded SS

device and a removable USB 2.0 device

■ Enables up to eight device connections

Enhanced Battery Charging

■ Each DS port complies with the USB Battery Charging v1.2

(BC v1.2) specification

■ Ghost Charge™: Each DS port can emulate a Dedicated

Charging Port (DCP) when the host is not connected to the US

port

■ Accessory Charger Adapter Dock (ACA-Dock): Enables

charging and simultaneous data transfer for a smart phone or

a tablet acting as a host compliant to BC v1.2

■ Apple charging supported on all DS ports

Integrated ARM® Cortex™-M0 CPU

■ 16 KB RAM, 32 KB ROM

■ Configure GPIOs for overcurrent protection, power enable, and

LEDs

■ Upgrade firmware using (a) I2C EEPROM or (b) an external

I2C master

Vendor-Command Support to Implement a USB-to-I2C

Bridge

■ Firmware upgrade of an external ASSP connected to HX3

through USB

■ In-System Programming (ISP) of the EEPROM connected to

HX3 through USB

Extensive Configuration Support

■ Pin-strap configuration for the following functions:

❐ Vendor ID (VID)

❐ Charging support for each DS port

❐ Number of active ports

❐ Number of non-removable devices

❐ Ganged or individual power switch enables for DS ports

❐ Power switch polarity selection

■ Custom configuration modes supported with eFuse, I2C

EEPROM, or I2C slave

❐ SS and USB 2.0 PHY parameters

❐ Product ID (PID)/VID, manufacturer, and product string

descriptors

❐ Swap DP/DM signals for flexible PCB routing

Software Features

■ Microsoft WHQL-certified for Windows XP/Vista/7/8/8.1

■ Compatible with Mac OS 10.9 and Linux kernel version 3.11

■ Customize configuration parameters with the easy-to-use

Cypress’s “Blaster Plus” software tool

Flexible Packaging Options

■ 68-pin QFN (8 × 8 × 1.0 mm)

■ 88-pin QFN (10 × 10 × 1.0 mm)

■ Industrial temperature range (–40 °C to +85 °C)

Errata: For information on silicon errata, see Errata on page 30. Details include trigger conditions, devices affected, and proposed workaround.

Cypress Semiconductor Corporation • 198 Champion Court

Document Number: 001-73643 Rev. *G

• San Jose, CA 95134-1709 • +1-408-943-2600

Revised March 14, 2014

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