SGA-8343 Просмотр технического описания (PDF) - Stanford Microdevices
Номер в каталоге
Компоненты Описание
производитель
SGA-8343 Datasheet PDF : 4 Pages
| |||
Absolute Maximum Ratings
Preliminary
SGA-8343 Low Noise SiGe HBT
Parameter
Collector Current
Base Current
Collector - Emitter Voltage
Collector - Base Voltage
Emitter - Base Voltage
Operating Temperature
Storage Temperature Range
Power Dissipation
Operating Junction Temperature
Symbol
IC
IB
VCEO
VCBO
VEBO
TOP
Tstor
PDISS
TJ
Value
72
1
5
12
4.5
-40 to +85
-40 to +150
325
+150
Unit
mA
mA
V
V
V
C
C
mW
C
Caution: ESD sensitive
Appropriate precautions in handling, packaging and
testing devices must be observed.
Part Number Ordering Information
Part Number
Reel Size
Devices/Reel
SGA-8343
7"
3000
Part Symbolization
The part will be symbolized with an “A83” and a
Pin 1 indicator on the top surface of the package.
Pin #
1
2
3
4
Pin Description
Function
Base
Emitter
Collector
Emitter
Description
RF Input
Connection to ground. Use via holes to reduce lead
inductance. Place vias as close to emitter leads as possible.
RF Output
Same as Pin 2
.079
.051±.002
Package Dimensions
.021
4
3
.049 CL
.025
.091
1
2
CL
.015 TYP(4X)
.024
.014
.035
.038
.005 TYP(4X)
.012
TYP(3X)
.024
A fully dimensioned package outline is available on our website.
NOTE:
1. ALL DIMENSIONS ARE IN INCHES
2. DIMENSIONS ARE INCLUSIVE OF PLATING
3. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH &
METAL BURR
4. ALL SPECIFICATIONS COMPLY TO EIAJ SC70 FOR
TRIM/FORM. ie: REVERSE TRIM/FORM
6. PACKAGE SURFACE TO BE MIRROR FINISH
Use multiple plated-through vias holes located close to the package pins to ensure a good RF ground connection to a
continuous groundplane on the backside of the board.
726 Palomar Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
4
http://www.stanfordmicro.com
EDS-101845 Rev. A
Share Link: 