SML-210X Просмотр технического описания (PDF) - ROHM Semiconductor

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производитель

SML-210X

Standard Type Mini-molded chip LEDs

ROHM Semiconductor 

SURFACE MOUNT LED LAMPS

Standard Type Mini-molded chip LEDs

SML-210 Series

Package Size

（mm）

Pure Green

GaP

555nm

Green

570nm

Yellow

Orange

          GaAsP on GaP

585nm

610nm

650nm

Red

GaAlAs on GaAs

660nm

2012

(0805)

2.0x1.25

t=0.8

SML-210PT

SML-210MT

SML-210YT

SML-210DT

SML-210VT

SML-210LT

■ Absolute Maximum Ratings（Ta=25℃）

Part No.

Emitting

color

Power

dissipation

PD

（mW）

Forward

current

IF

（mA）

Peak

forward

current

＊IFP

（mA）

Reverse Operating Stotage

voltage temperature temperature

VR

Topr

Tstg

（V） （°C）

（°C）

SML-210PT Pure Green

SML-210MT Green

SML-210YT Yellow

70

25

60

SML-210DT Orange

SML-210VT

Red

SML-210LT

Red

75

30

75

＊IFP measured under duty ≦1/ 5,pulse width ≦1ms.

4

-30 to +85 -40 to +85

■ External Dimensions（Unit：mm）

2.0

＋0.2

0

1.4

Cathode mark

1.2

Terminal

■ Electrical Optical Characteristics（Ta=25℃）

Part No.

SML-210PT

SML-210MT

SML-210YT

SML-210DT

SML-210VT

SML-210LT

Forward

voltage

Resin Color

VF

Reverse

current

IR

Typ. IF Max. VR

(V) (mA) (µA) (V)

2.2

Transparent 2.1

Clear

20 100 4

2.0

1.75

Light wavelength

Peak Half-wave

λp ∆λ

Typ. Typ. IF

(nm) (nm) (mA)

Brightness

IV

Min. Typ. IF

(mcd) (mcd) (mA)

555

1.4 4

570

3.6 16

585 40

20 2.2 6.3 20

610

650

1.4 4

660 25

3.6 10

Tolerance:±0.1

■ Directivity

0°

X’

Y’

30°

30°

60°

60°

90°

100

50

0

50

Relative brightness (%)

90°

100

(Typ.)

■ Recommemded Pad Layout

■ Packaging Spacifications（Unit：mm）

Tape Spacifications：T86〈3,000pcs／reel〉

1.1

Feeding direction

4

2

φ1.5

（Unit：mm）

The recommended thickness of the screen mask

for soldering is between 100 and 200μm. The

hole size of the screen mask should be same as

the recommended land pattern or smaller.

1.7

1.0

Reel Spacifications

φ13

φ60

φ180

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