RL1206JR-131RH Просмотр технического описания (PDF) - YAGEO Corporation
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RL1206JR-131RH Datasheet PDF : 9 Pages
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Chip Resistor Surface Mount RL SERIES 0402 to 2512
Product specification 8
9
TEST
Solderability
- Wetting
TEST METHOD
PROCEDURE
REQUIREMENTS
IPC/JEDECJ-STD-002B test B
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Well tinned (≥95% covered)
No visible damage
- Leaching
IPC/JEDECJ-STD-002B test D Leadfree solder, 260 °C, 30 seconds
immersion time
No visible damage
- Resistance to IEC 60068-2-58
Soldering Heat
Condition B, no pre-heat of samples.
Leadfree solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
±1%
No visible damage
Mar 22, 2010 V.5
www.yageo.com
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