RL1206JR-131RH Просмотр технического описания (PDF) - YAGEO Corporation

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производитель

RL1206JR-131RH

Chip Resistor Surface Mount LOW OHMIC CHIP RESISTORS

YAGEO Corporation 

Chip Resistor Surface Mount RL SERIES 0402 to 2512

Product specification 7

9

TESTS AND REQUIREMENTS

Table 4 Test condition, procedure and requirements

TEST

TEST METHOD

PROCEDURE

Life/

Endurance

IEC 60115-1 4.25.1

1,000 hours at 70±5 °C applied RCWV

1.5 hours on, 0.5 hour off, still air required

REQUIREMENTS

±2%

High Temperature

Exposure/

Endurance at upper

category temperature

IEC 60068-2-2

1,000 hours at maximum operating

±1%

temperature depending on specification,

unpowered

No direct impingement of forced air to the

parts

Tolerances: 125±5 °C

Moisture Resistance

MIL-STD-202G Method-106G Each temperature / humidity cycle is defined at ±2%

8 hours (method 106F), 3 cycles / 24 hours for

10d with 25 °C / 65 °C 95% R.H, without

steps 7a & 7b, unpowered

Parts mounted on test-boards, without

condensation on parts

Measurement at 24±2 hours after

test conclusion

Thermal Shock

MIL-STD-202G Method-107G -55/+125 °C

±1%

Note: Number of cycles required is 300.

Devices unmounted

Maximum transfer time is 20 seconds. Dwell

time is 15 minutes. Air – Air

Short time overload IEC60115-1 4.13

Board Flex/

Bending

IEC 60068-2-21

2.5 times RCWV or maximum overload

voltage whichever is less for 5 sec at room

temperature

Device mounted on PCB test board as

described, only 1 board bending required

3 mm bending

Bending time: 60±5 seconds

Ohmic value checked during bending

±2%

No visible damage

±1%

No visible damage

Mar 22, 2010 V.5

www.yageo.com

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