UPC4742GR-9LG Просмотр технического описания (PDF) - NEC => Renesas Technology
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UPC4742GR-9LG
NEC => Renesas Technology
UPC4742GR-9LG Datasheet PDF : 10 Pages
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μ PC842GR-9LG, μ PC4742GR-9LG
<R> RECOMMENDED SOLDERING CONDITIONS
The μ PC842GR-9LG, μ PC4742GR-9LG should be soldered and mounted under the following recommended
conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
μ PC842GR-9LG-A Note, μ PC4742GR-9LG-A Note: 8-pin plastic TSSOP (5.72 mm (225))
Process
Conditions
Infrared ray reflow
Wave soldering
Partial heating method
Peak temperature: 260°C, Reflow time: 60 seconds or less (at 220°C or higher),
Maximum number of reflow processes: 3 times.
Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum
number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Note Pb-free (This product does not contain Pb in external electrode and other parts.)
Symbol
IR60-00-3
WS60-00-1
P350
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.
Remark Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<R> REFERENCE DOCUMENTS
Document Name
QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES
SEMICONDUCTOR DEVICE MOUNT MANUAL
NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL
SYSTEM-STANDARD LINEAR IC
REVIEW OF QUALITY AND RELIABILITY HANDBOOK
NEC SEMICONDUCTOR DEVICE RELIBIALITY/QUALITY CONTROL
SYSTEM
Document No.
C11531E
http://www.necel.com/pkg/en/mount/index.html
IEI-1212
C12769E
C10983E
Data Sheet G17932EJ4V0DS
9
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