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UPC1555C Просмотр технического описания (PDF) - NEC => Renesas Technology

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Компоненты Описание
производитель
UPC1555C
NEC
NEC => Renesas Technology NEC
UPC1555C Datasheet PDF : 12 Pages
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µPC1555
RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the µPC1555.
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Surface-Mount Devices
For details of the recommended soldering conditions, refer to our document SMD Surface Mount Technology
Manual (IEI-1207).
µPC1555G2
Soldering process
Infrared reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Peak package’s surface temperature: 230°C
Reflow time: 30 seconds or less (at 210°C or more)
Maximum allowable number of reflow processes: 1
Exposure limit: NoneNote
Peak package’s surface temperature: 215°C
Reflow time: 40 seconds or less (at 200°C or more)
Maximum allowable number of reflow processes: 1
Exposure limit: NoneNote
Temperature in the soldering vessel: 260°C or less
Soldering time: 10 seconds or less
Maximum allowable number of reflow processes: 1
Exposure limit: NoneNote
Pin temperature: 300°C or less
Flow time: 10 seconds or less
Exposure limit: NoneNote
Symbol
IR30-00
VP15-00
WS60-00
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25°C or less and maximum relative humidity of 65% or less
Caution Do not apply more than a single process at once, except for “Partial heating method.”
Through-Hole Mount Devices
µPC1555C
Soldering process
Wave soldering
Soldering conditions
Temperature in the soldering vessel: 260°C or less
Soldering time: 10 seconds or less
REFERENCE
Document name
NEC Semiconductor Device Reliability/Quality Control System
Quality Grade on NEC Semiconductor Devices
Semiconductor Device Mounting Technology Manual
Semiconductor Device Package Manual
Guide to Quality Assurance for Semiconductor Devices
Semiconductor Selection Guide
Document No.
IEI-1212
IEI-1209
IEI-1207
IEI-1213
MEI-1202
MF-1134
11

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